Title:
METHOD FOR DETECTING OPTIMUM POLISHING RATIO
Document Type and Number:
Japanese Patent JPH04260450
Kind Code:
A
Abstract:
PURPOSE: To accurately find out the optimum polishing ratio on the basis of knowledge such that the polishing ratio optimum to the completion of rice polishing work is present in the vicinity of the boundary of an endosperm part and a viscous powder layer.
CONSTITUTION: Unpolished rice is polished and, at each time when a polishing ratio reaches a predetermined one, for example, at every 0.1% during polishing, a sample for evaluation corresponding to each polishing ratio is collected and the predetermined component of the collected sample is quantitatively analyzed and, when the content thereof reaches a predetermined value, the polishing ratio corresponding to said predetermined value is detected as the optimum one.
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Inventors:
MORI TAIICHI
KAMIYA KOSEN
FUJIOKA SADAKAZU
KAMIYA KOSEN
FUJIOKA SADAKAZU
Application Number:
JP7598791A
Publication Date:
September 16, 1992
Filing Date:
February 14, 1991
Export Citation:
Assignee:
ISEKI AGRICULT MACH
International Classes:
B02B7/00; G01N33/10; (IPC1-7): B02B7/00; G01N33/10
Attorney, Agent or Firm:
Tetsuro Maki (2 outside)
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