Title:
METHOD FOR DETECTING THICKNESS IN BENDING MACHINE, DEVICE THEREFOR, BENDING METHOD AND BENDING MACHINE
Document Type and Number:
Japanese Patent JP3720099
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To exactly detect thickness and to enble accurate bending work.
SOLUTION: At the time of executing the bending work of a metal plate by cooperation of a punch P and die D by making an upper table and a lower table relatively approach, by detecting contact point of the punch P with the metal plate W with a thickness detector 29, also detecting the thickness of the metal plate W from it and further feeding the punch P by the infeed amount in accordance with the detected thickness by the command of a controller 15, bending work is executed. The contact point of the punch P with the metal plate W is detected with a contact point detecting means 35 and the thickness of the metal plate W and the thickness of the metal plate W is detected from the relation between the position of the contact point and the position of the die D by a thickness calculating part 37. For detecting this contact point, the amount of change of acceleration of the movement of the punch P, change of the moving speed of the table, acceleration of the table 7, distance to the metal plate W, etc., are used.
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Inventors:
Hitoshi Omata
Osamu Hayama
Hiroyuki Hoshina
Osamu Hayama
Hiroyuki Hoshina
Application Number:
JP29304495A
Publication Date:
November 24, 2005
Filing Date:
November 10, 1995
Export Citation:
Assignee:
Amada Co., Ltd.
International Classes:
G01B21/08; B21D5/02; (IPC1-7): B21D5/02; G01B21/08
Domestic Patent References:
| JP5138254A | ||||
| JP2030327A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu