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Title:
METHOD OF DETECTING TILT OF VACUUM-CHUCKED ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2000278000
Kind Code:
A
Abstract:

To realize an electronic component tilt chucking detecting method, using an electronic component thickness measuring apparatus with a linear image sensor, irrespective of the shape of electronic component and lessen the mounting failure of electronic components to improve the production efficiency of an electronic component mounting machine.

In an electronic component thickness measurement in measuring an electronic component mounting machine, an electronic component which is chucked normally and measured continuously to obtain electronic component thicknesses H(1)-N(n), they are added up to obtain the sectional area of a component 31, and it is stored in a memory as a reference value in the chucking state. Every time the electronic component thickness is measured, the sectional area of an electronic component chucked by a nozzle is compared with the reference value to detect the tilt chucking of the component 31. When the sectional area agrees with the reference value, it is decided to be a normal chucking state, and the mounting on a substrate is executed. If it does not agree, it is decided to be a tilted chucking, and no mounting is made.


Inventors:
Nakane, Masao
Nakano, Kazuyuki
Application Number:
JP1999000082666
Publication Date:
October 06, 2000
Filing Date:
March 26, 1999
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K13/08; G01B11/06; (IPC1-7): H05K13/08; G01B11/06
Attorney, Agent or Firm:
森本 義弘