Title:
METHOD AND DEVICE FOR BONDING OF OBJECT USING ROBOT
Document Type and Number:
Japanese Patent JP2632271
Kind Code:
B2
Abstract:
PURPOSE: To effect bonding of an object satisfactorily by applying an adhesive to the object regardless of a liquid level of a tank by a method wherein the adhesive is taken into a small vessel from the tank, which vessel is then raised to a predetermined level and the adhesive is applied to an end of the object and excessive adhesive is scraped off by means of a scraping member.
CONSTITUTION: A small vessel 4 smaller than a tank 2 is moved by a vertically moving device 8 to scoop up an adhesive 1 from the tank 2 storing therein the adhesive 1 and the vessel 4 is then raised to a predetermined position 5 above the tank 2 and an end 8 of a member 7 to be bonded held by a robot 6 is brought down from above into the vessel 4 to apply the adhesive to this end. Then the member 7 is raised from the vessel 4 and moved into contact with a scraping member 12 provided above the tank 2 to scrape off excessive adhesive 1, following which the member 7 is brought into contact with other member 13 to join it thereto. Consequently, even if the liquid level of the tank 2 varies as the bonding work advances, the bonding work can be performed satisfactorily.
Inventors:
OOTA KAZUHISA
ICHIKAWA SEIGO
ICHIKAWA SEIGO
Application Number:
JP10993492A
Publication Date:
July 23, 1997
Filing Date:
April 28, 1992
Export Citation:
Assignee:
MORIKAWA SANGYO KK
International Classes:
B05B12/00; B05C3/02; B05D1/18; C09J5/00; (IPC1-7): B05D1/18; B05C3/02
Domestic Patent References:
| JP57195473U | ||||
| JP6218293Y2 |
Attorney, Agent or Firm:
Yu Saito (2 outside)