Title:
METHOD AND DEVICE FOR CLEANING SUBSTRATE
Document Type and Number:
Japanese Patent JP2793504
Kind Code:
B2
Abstract:
PURPOSE: To provide a substrate cleaning method and a device therefor to remove the particles of a grinding agent that remain on a substrate after an interlayer insulation film is polished for planarization.
CONSTITUTION: After a substrate holding disc 2 is cleaned by spraying simultaneously an electrolytic ionized water 13 and a nitrogen gas 27 thereto, a substrate 1 is turned while the outer circumferential part of the rear face thereof is held, and at the same time, the substrate 1 is roughly cleaned by a rotary brush 28 in a state where a protective liquid film is formed on the rear face of the substrate by a water stream, further the water 13 and gas 27 are simultaneously sprayed onto the turning substrate, thereby spattering the silica particles remaining on the surface of the substrate outwardly with a centrifugal force.
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Inventors:
HAYASHI YOSHIHIRO
TOMITAKA TOMOFUMI
TOMITAKA TOMOFUMI
Application Number:
JP11550194A
Publication Date:
September 03, 1998
Filing Date:
May 27, 1994
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
B08B3/02; H01L21/304; (IPC1-7): H01L21/304
Domestic Patent References:
| JP2185032A | ||||
| JP3242919A | ||||
| JP62122131A | ||||
| JP61100950A | ||||
| JP6455843A | ||||
| JP3124027A | ||||
| JP4206724A | ||||
| JP487638U |
Attorney, Agent or Firm:
Naoki Kyomoto