To provide a device of controlling a semiconductor manufacturing equipment which can continue treatment of a wafer continuously when treatment conditions are renewed at a wafer unit.
The device has an equipment control unit 104 for collecting information of the state of a semiconductor manufacturing equipment 105; an equipment information memory part 106 for allocating a treatment chamber for each slot of a treatment lot, on the basis of the collected information on the condition of the semiconductor manufacturing equipment 105; a lot information collector 102 for collecting lot information from a production progress management 101; and a parameter calculator 103 for calculating treatment conditions at a treatment chamber unit, based on the collected state information and lot information of the semiconductor manufacturing equipment 105. The equipment control unit 104 carries out recognition of an object treatment chamber of a treatment object slot to the equipment information memory 106, collects treatment conditions in the object treatment chamber to the parameter calculator 103, sets treatment conditions of the treatment object slot to the object treatment chamber, and carries out remote control.
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada