Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD AND DEVICE FOR CUTTING RING MATERIAL
Document Type and Number:
Japanese Patent JP2005169555
Kind Code:
A
Abstract:

To improve the service life of a cutting edge while reducing damage to the cutting edge in cutting a ring material while rotating it.

In a method of cutting the ring material, a first cutting process is carried out by moving the ring material W to be cut, forward toward the cutting edge 21 while rotating the ring material W, and stopping the rotation of the ring material W after slitting the whole periphery with the cutting edge 21 leaving only a preset dimension out of the thickness of the ring material W. A second cutting process is carried out by stopping the forward movement of the ring material W after moving the ring material W forward and slitting the ring material W until cutting through only a part of the ring material W, then moving the ring material W backward and rotating the ring material W again to position the remaining uncut part U into a cutting position, and stopping rotation. The whole periphery of the remaining uncut part U is cut by repeating the second cutting process. Consequently, since cutting conditions do not notably change when cutting through, a large force is not applied to one tooth of the cutting edge 21, which results in preventing damage to the cutting edge 21.


Inventors:
NOGUCHI HIROAKI
Application Number:
JP2003412018A
Publication Date:
June 30, 2005
Filing Date:
December 10, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AMADA CO LTD
International Classes:
B23D53/06; B23D45/12; B23D55/04; (IPC1-7): B23D53/06; B23D45/12; B23D55/04
Domestic Patent References:
JP2002283136A2002-10-03
JP2002066835A2002-03-05
JPH0325786U1991-03-15
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu