Title:
METHOD AND DEVICE FOR DIVIDING OPTICAL WAVEGUIDE BODY
Document Type and Number:
Japanese Patent JPS6023807
Kind Code:
A
Abstract:
A method and apparatus for cutting light waveguides by clamping the waveguides into clamping devices, stressing the clamped waveguides and then notching the stressed waveguides to initiate the cutting operation. The method and apparatus include an actuation element which opens the two clamping devices, releases the tensioning device and withdraws the notching device in a particular sequence and on release of the actuation element first allows the clamping devices to grip the waveguide, then has the tensioning device pivot one of the clamping devices to apply an axial tension on the waveguide and subsequently allows the notching device to notch the waveguide to initiate the cutting operation.
Inventors:
DEIITAA KURAUZE
Application Number:
JP12499884A
Publication Date:
February 06, 1985
Filing Date:
June 18, 1984
Export Citation:
Assignee:
SIEMENS AG
International Classes:
C03B37/16; G02B6/00; G02B6/25; B26F3/00; (IPC1-7): B26F3/00; C03B37/16; G02B6/00
Attorney, Agent or Firm:
Tomimura Kiyoshi
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