Title:
METHOD AND DEVICE FOR EXPOSURE, AND MANUFACTURE OF INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JP3211810
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To correct tilt of a sensitized substrate most efficiently and accurately according to exposure region of a projection optical system and surface condition of the sensitized substrate, etc., when a pattern formed on a reticule is projected for exposure on the sensitized substrate through a projection optical system.
SOLUTION: Leveling detection optical systems 19-22 for measuring tilt of a specified exposure shot position on a surface of a wafer 18 which is to be exposed, an input means 26 for setting a measurement prohibited region on the surface, which is to be exposed, of the wafer 18 where no actual value for tilt is used, and leveling mechanisms 23 and 25 for correcting tilt of exposure shot positions on the surface which is to be exposed according to the measuring result of the leveling detection optical system and its measurement prohibited region, are provided.
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Inventors:
Masahiro Nei
Application Number:
JP11775999A
Publication Date:
September 25, 2001
Filing Date:
April 26, 1999
Export Citation:
Assignee:
NIKON CORPORATION
International Classes:
H01L21/027; G01B11/26; G03F7/20; (IPC1-7): H01L21/027; G01B11/26; G03F7/20
Domestic Patent References:
| JP1112726A | ||||
| JP2102518A | ||||
| JP2198130A |