Title:
METHOD AND DEVICE FOR FILLING SPACE BELOW PIPE OF PIPE BODY LAID ON WATER BOTTOM
Document Type and Number:
Japanese Patent JP3388385
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and device for filling a space below the pipe of a pipe body laid on a water bottom to completely fill a gap without increasing a gap below a laid pipe body, eliminating a need for a deep recessed groove for laying a pipe body, and desides exerting the load of the pipe body by a refilling material under the pipe body and decreasing the thickness of the pipe body.
SOLUTION: A refilling material 4, such as crushed stone and/or sand, is mixed with water on a ground or on a soil carriage ship 6 to produce slurry. The slurry is fed through a conveyance pipe 12 to the side of a pipe body 2 laid on a water bottom. By injecting slurry with the opening of the conveyance pipe 12 pointing toward a position below the pipe body 3 laid on a water bottom, a gap below the pipe body laid on a water bottom is filled with the refilling material 4. The refilling material 4 is charged to one side of the pipe body 2 laid on a water bottom installed in a recessed groove 1 for laying a pipe, one side of a gap below a pipe body for laying is closed, and thereafter the slurry is injected from the other side part.
Inventors:
Jiro Hara
Shigehiro Ozaki
Shinobu Yamazaki
Yoshitaka Otani
Sadao Tage
Shigeru Inoue
Shigehiro Ozaki
Shinobu Yamazaki
Yoshitaka Otani
Sadao Tage
Shigeru Inoue
Application Number:
JP29799298A
Publication Date:
March 17, 2003
Filing Date:
October 20, 1998
Export Citation:
Assignee:
Shikoku Electric Power Co., Inc.
Siden Technology Consultant Co., Ltd.
Goyo Construction Co., Ltd.
Siden Technology Consultant Co., Ltd.
Goyo Construction Co., Ltd.
International Classes:
E02B3/00; E02D17/12; F16L1/024; F16L1/12; (IPC1-7): F16L1/12; E02B3/00; E02D17/12
Domestic Patent References:
| JP57178018A | ||||
| JP7127042A |
Attorney, Agent or Firm:
Masao Tanaka