To provide a method and device by which an insulating film is formed in which pores can be formed uniformly.
The molecular active species of 1, 3, 5-trimethyl-1, 3, 5-trivinyl siloxane (V3D3) and isopropyl alcohol (IPA) are generated by supplying the compounds to a chamber 12 and exciting the compounds with a plasma. Then, for example, a thin insulating film containing IPA molecules and having a thickness of 50 nm is formed by causing the active species to react to each other near the surface of a substrate. In addition, pores are formed uniformly in the thickness direction in the thin film by selectively eliminating the IPA molecules contained in the thin film through a plasma treatment performed by using an ammonia gas. By repeating the film forming step and pore forming step a plurality of times, the insulating film having a prescribed thickness and containing uniformly formed pores can be obtained.
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WO/2015/170774 | SEMICONDUCTOR SUBSTRATE, EPITAXIAL WAFER, AND METHOD FOR MANUFACTURING EPITAXIAL WAFER |
KAGAWA KEIEI
KAWAMURA GOHEI
TEI MOTOICHI
JP2000216153A | 2000-08-04 | |||
JPH0729897A | 1995-01-31 | |||
JP2002134494A | 2002-05-10 | |||
JPH11176829A | 1999-07-02 |
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