To provide a method for manufacturing a field effect transistor with source and drain on an insulator.
A method for forming a field effect transistor includes a step for forming a first void region 11 in the outer surface of a semiconductor body 10 and a step for forming a second void region 11 which is separated from the first void region by a portion of the semiconductor body 10 in the outer surface of a semiconductor body 10. The method further includes a step for depositing a dielectric material in the first void region to form a first insulating region 16 and a step for depositing dielectric material in the second void region to form a second insulating region 16. The method further includes a step for planarizing the first and second insulating regions to define a planar surface 17. The method also includes a step for forming a conductive source region 34 overlying the first insulating region, a step for forming a conductive drain region 36 overlying the second insulating region and a step for forming a conductive gate body overlying the planar surface and spaced apart from the conductive source region and the conductive drain region.