Title:
METHOD AND DEVICE FOR GENERATING SCRAP LINE FOR LASER PROCESS
Document Type and Number:
Japanese Patent JP3069176
Kind Code:
B2
Abstract:
PURPOSE: To automate scrap line generation for parting a scrap into proper size in the generation of a laser process program.
CONSTITUTION: When the NC program for cutting a blank plate material 10 into products 20 by the laser process is generated, a drawing file is displayed on a CAD screen for the blanking of the products 20. After the blanking, a command is given and then scrap lines 40 and 50 having a coordinate origin at a corner part 15 of the plate material 10 are drawn in an X and a Y direction at constant intervals. Parts which are close to cutting lines of the products within a certain distance are removed to complete the scrap lines.
Inventors:
Yoshihiko Sakai
Yoshihisa Yamaoka
Yoshihisa Yamaoka
Application Number:
JP31308591A
Publication Date:
July 24, 2000
Filing Date:
November 01, 1991
Export Citation:
Assignee:
Kiwa Giken Co., Ltd.
International Classes:
B23K26/00; B23Q15/00; G05B19/19; G05B19/4093; (IPC1-7): G05B19/4093; B23K26/00
Domestic Patent References:
| JP463616A | ||||
| JP439706A | ||||
| JP3174996A | ||||
| JP464480U |
Attorney, Agent or Firm:
Yoshiaki Numagata (1 person outside)