Title:
METHOD AND DEVICE FOR GRINDING NOTCH OF POLISHING BY VIBRATION OF THE SUBSTRATE
Document Type and Number:
Japanese Patent JP2008284683
Kind Code:
A
Abstract:
To provide an improved method and device for cleaning or polishing a notch of a substrate edge portion.
The device for polishing the notch 244 of the substrate edge portion comprises: a substrate supporting element suitable for supporting a substrate 216; a polishing head suitable for contacting the notch 244 of the substrate edge portion; and a controller suitable for vibrating the substrate 216 at least between first and second vibrating positions.
Inventors:
ZHANG ZHENHUA
KO SEN-HOU
KO SEN-HOU
Application Number:
JP2008132086A
Publication Date:
November 27, 2008
Filing Date:
May 20, 2008
Export Citation:
Assignee:
APPLIED MATERIALS INC
International Classes:
B24B9/00; B24B1/04; B24B21/00
Domestic Patent References:
| JPH07124853A | 1995-05-16 | |||
| JPH07164301A | 1995-06-27 | |||
| JPH04364727A | 1992-12-17 | |||
| JP2000263405A | 2000-09-26 | |||
| JP2005252288A | 2005-09-15 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Ikeda adult
Yuichi Yamada
Ikeda adult