Title:
METHOD AND DEVICE FOR GRINDING OUTER PERIPHERY OF WORK
Document Type and Number:
Japanese Patent JP3445237
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To perform machining of a chamfer surface without the occurrence of a step to the surface of a disc-form work, such as a semiconductor wafer.
SOLUTION: A chamfer surface formed at the outer peripheral part of a work W is polished through relative rotation of a grinding ring 27 and a work by at least either one of the grinding ring or the work. The polishing ring 27 has an inner peripheral grinding surface 35 in a recess shape formed in an inclination state between a small diameter part 33 and a large diameter part 34, and a rotation center axis Ow of the work is inclined on a base of a grinding center axis Og and the chamfer surface is brought into contact with the inner peripheral grinding surface 35 in a manner that the work W crosses the inner peripheral grinding surface 35. Since this action brings overhang parts Wa and Wb of the work W into a state to be pushed out from the small diameter part 33 and the large diameter part 34, a polishing pad is prevented from making contact with the surface side of the work W and a step is prevented from occurring to the work W as a result of machining.
Inventors:
Katsunori Nagao
Isao Nagahashi
Isao Nagahashi
Application Number:
JP2000328139A
Publication Date:
September 08, 2003
Filing Date:
October 27, 2000
Export Citation:
Assignee:
System Seiko Co., Ltd.
International Classes:
B24B9/00; H01L21/304; (IPC1-7): B24B9/00; H01L21/304
Domestic Patent References:
| JP1170450A | ||||
| JP2000167753A | ||||
| JP11221744A |
Attorney, Agent or Firm:
Yamato Tsutsui (1 person outside)
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