Title:
METHOD AND DEVICE FOR HEATING AND COOLING TEST
Document Type and Number:
Japanese Patent JP2011112518
Kind Code:
A
Abstract:
To provide a method for heating and cooling test, capable of testing by imparting a thermal conduction phenomenon the same as self-heating to an electronic component mounted on a circuit board.
In the method, an electromagnetic wave having different irradiated heat quantity per unit of time such as a laser beam 7 irradiates the surface of the electronic components 2a and 2b mounted on the circuit board 1, the temperature rising speed of the electronic component is controlled, and a temperature cycle is repeated so that the temperature reaches the predetermined highest temperature and is kept, and then the temperature is kept at the predetermined lowest temperature by cooling the circuit board 1 with a Peltier element 3.
Inventors:
NISHIKAWA YUKIO
SAKURAI TSUTOMU
ONO YUKIYOSHI
ONISHI YOICHI
SAKURAI TSUTOMU
ONO YUKIYOSHI
ONISHI YOICHI
Application Number:
JP2009269362A
Publication Date:
June 09, 2011
Filing Date:
November 27, 2009
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
G01N25/72; G01N25/18
Attorney, Agent or Firm:
Yohei Harada
Yoshihiro Morimoto
Yoshihiro Morimoto