To early detect display picture abnormality due to an element reliability defect of a thin film transistor and to reduce processes and a cost by performing an energizing stress inspection for a peripheral circuit of an active matrix array.
The energizing stress inspection is performed for many active matrix arrays formed on a glass substrate, and obtained by integrating the peripheral circuits each by a thin film transistor circuit on the same substrate (S1-2), and thereafter, the operation confirming inspection of the peripheral circuit of the active matrix array is performed by a prescribed method (S1-3). The energizing stress inspection performed only after a panel for conventional liquid crystal display device is finished is performed in the state of the active matrix array before a panel assembly is performed, therefore the display picture abnormality due to the element reliability defect of the thin film transistor is early detected. For the defect parts, the processes of the liquid crystal injection or the flexible substrate mounting, etc., are eliminated.
URAOKA YUKIHARU
KAWAMURA TETSUYA
