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Title:
METHOD AND DEVICE OF INSPECTING AND MANAGING SUBSTRATE
Document Type and Number:
Japanese Patent JP2012064831
Kind Code:
A
Abstract:

To provide a method and a device of inspecting and managing a substrate in which inspection items of the inspection device are determined based on device configuration change information from a component mounting device.

The device of inspecting a substrate comprises: a device configuration change information acquisition unit 43 which acquires device configuration change information from a component mounting device 12; an inspection item determination unit 44 which determines the inspection items of an inspection device (13) that inspects a circuit board S based on the device configuration change information acquired by the device configuration change information acquisition unit; and an inspection item designation unit 45 which designates the items of inspection of the circuit board performed by the inspection device based on the inspection items determined by the inspection item determination unit.


Inventors:
KATO DAISUKE
Application Number:
JP2010208881A
Publication Date:
March 29, 2012
Filing Date:
September 17, 2010
Export Citation:
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Assignee:
FUJI MACHINE MFG
International Classes:
H05K13/08
Domestic Patent References:
JP2003124699A2003-04-25
JP2010016028A2010-01-21
JP2010087450A2010-04-15
JP2006332461A2006-12-07
JP2004235582A2004-08-19
Attorney, Agent or Firm:
Kobayashi Osamu