Title:
METHOD AND DEVICE FOR INSPECTING PRINTED SOLDER
Document Type and Number:
Japanese Patent JP3411903
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To control the quality of printed circuit boards by enabling the mass of the solder transferred to the printed circuit boards carried continuously in a manufacture line to be obtained at real time.
SOLUTION: Printed circuit boards after solder printing are carried one by one continuously into an inspection device on a line. A sensor head 20 detects and outputs the quantity of displacement corresponding to the projection of each solder by scanning on a printed board. Moreover, the scanning position of the sensor head 20 is detected. A mass computation means 37 gets the total sum of the volume of each solder based on the scanning position and the quantity of displacement, and then gets the mass of the total solder transferred onto the printed circuit board by multiplying it by the specified gravity of the solder stored in a storage means 38.
Inventors:
Takashi Suzuki
Yasuhisa Nakamichi
Yasuhisa Nakamichi
Application Number:
JP2000374817A
Publication Date:
June 03, 2003
Filing Date:
December 08, 2000
Export Citation:
Assignee:
Anritsu Corporation
International Classes:
G01B11/00; G01B11/02; G01B11/24; G01C3/06; H05K3/34; (IPC1-7): H05K3/34; G01B11/00; G01B11/02; G01B11/24; G01C3/06
Domestic Patent References:
| JP1117328A | ||||
| JP674719A |
Attorney, Agent or Firm:
Norimitsu Nishimura
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