METHOD AND DEVICE FOR LASER PEENING

Title:

METHOD AND DEVICE FOR LASER PEENING

Document Type and Number:

Japanese Patent JP2015093284

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a method and device for laser peening capable of implementing laser peening readily and reliably.SOLUTION: The method and device for laser peening radiates a second laser beam B with a second laser intensity stronger than a first laser intensity and a second pulse width narrower than a first pulse width while radiating a first laser beam A with the first laser intensity and the first pulse width to a surface of an object 16 with, to a part to which the first laser beam A is radiated in the surface of the object.

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Inventors:

HAYASHI TAKAYUKI
HIEJIMA HIROYOSHI
OTA MICHIHARU
OKAMOTO AKIHIRO
OKAZAKI AKIRA

Application Number:

JP2013232195A

Publication Date:

May 18, 2015

Filing Date:

November 08, 2013

Export Citation:

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Assignee:

AISIN SEIKI

International Classes:

B23K26/352; B23K26/00; B23K26/06; B23K26/08; C21D7/06

Attorney, Agent or Firm:

Okabe
Koji Yoshizawa
Takashi Kawasaki

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