METHOD AND DEVICE FOR MANUFACTURING ELECTRONIC PART MOUNTING FILM CARRIER TAPE

Japanese Patent JP3794619

B2

PROBLEM TO BE SOLVED: To provide the manufacturing method of an electronic part mounting film carrier tape and a manufacturing method therefore superior in durability and capable of sure electric connection by hardly detaching a conductive metal ball in a film carrier such as a solder ball as an outside connection terminal.
SOLUTION: The film carrier tape forming a wiring pattern on one face of an insulation film is separated at a prescribed distance so as to be opposed to the surface of the film carrier tape, a surface electrode is arranged in a gold plating bath, separated at a prescribed distance so as to be opposed to the rear face of the film carrier tape, when the back electrode is arranged and submerged in the gold plating bath, the gold plating bath is carried together with a shielding member while the shielding member is paralleled on the backside of the film carrier tape to be shielded, and the plating thickness of the gold plating layer deposited electrolytically on the surface of the electronic part side connection terminal of the film carrier tape is formed thicker than that of the gold plating layer deposited electrolytically on the backside of the film carrier tape.

JP5854574	Metallic materials for electrical contact parts
WO/1993/020264	METHOD OF PRODUCING LAMELLAR MATERIAL OR LAMELLAR PARTS FOR PLAIN BEARINGS

Hiroaki Kurihara
Naoya Yasui

JP2001024121A

July 05, 2006

January 31, 2001

Click for automatic bibliography generation  

Mitsui Mining & Smelting Co., Ltd.

C25D5/10; H01L23/12; C25D5/16; C25D7/00; C25D7/06; H01L21/60; (IPC1-7): H01L23/12; C25D5/10; C25D5/16; C25D7/00; C25D7/06; H01L21/60

JP11016957A
JP7193166A
JP2225694A
JP2002198635A

Shunichiro Suzuki
Koji Makimura
Chihata Takahata
Toru Suzuki

Previous Patent: アリール置換プロパノールアミン誘導体、その製造法、その化合物を含有�...

Next Patent: METHOD AND DEVICE FOR MANUFACTURING ELECTRONIC PART MOUNTING FILM CARRIER TAPE