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Title:
METHOD AND DEVICE FOR MANUFACTURING GYPSUM BOARD
Document Type and Number:
Japanese Patent JP2000071218
Kind Code:
A
Abstract:

To find immediately the cutting of an upper paper and/or a lower paper generated by foreign matters mixed in or the like and not discontinue the manufacture by expanding the interval between an upper molding machine and a lower molding machine when electric current is transmitted into an electric circuit during the manufacture of a gypsum board.

When an upper paper 1 is broken, an upper plate 5 and an upper electrode 7 are brought into contact with gypsum slurry 3. The gypsum slurry 3 is slurry formed of calcined gypsum with water and an electric conductor. One electric circuit, therefore, is formed between the side of the upper plate 5, an upper electrode 7 and an electric current sensor 9, and an air cylinder 10 is actuated by the electric current sensor 9 to lift the upper plate 5 to the dot-line position. A clearance between the upper plate 5 and the lower plate 6 is enlarged and foreign matters caught on the plates can be passed through easily between the plates 5 and 6 to eliminate the cause of conduction, for example, paper cutting and not breaking the upper paper 1 and/or the lower paper 2 any more.


Inventors:
SASAKI KUNITOSHI
SHIMOJIMA MIKIYOSHI
ENDO SHOICHI
YONEZAWA SHINJI
Application Number:
JP24398098A
Publication Date:
March 07, 2000
Filing Date:
August 28, 1998
Export Citation:
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Assignee:
YOSHINO GYPSUM CO
International Classes:
E04C2/04; B28B1/16; B28B3/12; B28B17/00; B28B19/00; C04B28/14; G01N27/20; (IPC1-7): B28B1/16; B28B3/12; C04B28/14; E04C2/04
Attorney, Agent or Firm:
Katsuhiro Yoshida (1 person outside)