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Title:
METHOD AND DEVICE FOR MANUFACTURING PACKAGE
Document Type and Number:
Japanese Patent JPH1177857
Kind Code:
A
Abstract:

To mold a package body section into a decent polygon.

A molding tool 23 is constituted of upper and lower bases 26 and 29, left and right side molds 24 and 25 on the upper side and left and right side molds 27 and 28 on the lower side. A package body section is pressed by the upper and lower bases 26 and 29, the left and right side molds 24 and 25 on the upper side and the left and right side molds 27 and 28 on the lower side. The periphery of the package can be pressed uniformly and the decent package can be molded by the arrangement.


Inventors:
SAGAWA DAISUKE
RALSMAGNAS PALM
Application Number:
JP24430597A
Publication Date:
March 23, 1999
Filing Date:
September 09, 1997
Export Citation:
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Assignee:
NIPPON TETRAPACK KK
International Classes:
B31B1/26; (IPC1-7): B31B1/26
Domestic Patent References:
JPS5024739A1975-03-17
JPS483989A
Attorney, Agent or Firm:
Hidekazu Miyoshi (5 others)



 
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