To provide a method and a device for packing a thin-plate substrate capable of reducing the number of slip sheets to be used by half.

A suction pad 11 sucks a cut portion 21 of slip sheets 2, and lifts the sucked cut portion 21 diagonally upwardly along the cut. A transfer arm 12 sucks one thin-plate substrate 3, and load the sucked thin-plate substrate 3 on a base portion 23 of the slip sheet 2. The suction pad 11 lowers the sucked and lifted cut portion 21, loads the sucked cut portion 21 in a covering manner onto the thin-plate substrate 3 loaded on the base portion 23, and the suction is released. The transfer arm 12 sucks and conveys the next thin-plate substrate 3, and the sucked thin-plate substrate 3 is loaded on the cut portion 21 loaded on the previous thin-plate substrate 3. The suction pad 11 and the transfer arm 12 repeat a series of actions until the number of the stacked thin-plate substrates 3 becomes the predetermined value.