Title:
METHOD AND DEVICE FOR PATTERN SIZE MEASUREMENT
Document Type and Number:
Japanese Patent JPS6454305
Kind Code:
A
Abstract:
PURPOSE:To facilitate and automate the handling of data by finding out a pattern to be measured from a high-density pattern formed on a wafer, and projecting a primary beam only on the part and measuring the pattern size. CONSTITUTION:A converting device 102 which inputs output data 101 from a CAD as MT converts the data 101 into the format of data which is easily processed by an electron beam length measuring instrument 105. Then a measurement schedule data generating device 103 which determines a measurement map, a register mark position, etc., in a wafer sends generated schedule data to a controller 104 and the electron beam length measuring instrument 105 starts measurement. Here, the length measuring instrument 105 is a stage with a laser interferometer and capable of high-accuracy positioning, so a position specified with the CAD data is found with + or -0.1mum accuracy.
Inventors:
HONDA TOSHIYUKI
Application Number:
JP21339887A
Publication Date:
March 01, 1989
Filing Date:
August 26, 1987
Export Citation:
Assignee:
NEC CORP
International Classes:
G01B21/02; G01R31/302; H01L21/66; G01B15/00; (IPC1-7): G01B15/00; G01B21/02; H01L21/66
Domestic Patent References:
| JPS50130474A | 1975-10-15 | |||
| JPS57110913A | 1982-07-10 | |||
| JPS61114121A | 1986-05-31 | |||
| JPS61124816A | 1986-06-12 | |||
| JPS6027809A | 1985-02-12 |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)