To provide a method and a device for conditioning a polishing pad capable of suppressing a decrease in polishing speed in the central part of a polishing object surface of a substrate such as a semiconductor wafer, and making the polished surface of the substrate flat uniformly over the entire surface of the substrate.
The method for conditioning uses a dresser 22 to subject a polishing pad 2 to conditioning on a polishing table 1 for polishing a thin film formed on a surface of a substrate W in slide-contact with the thin film where the conditioning of the polishing pad 2 is performed at a moving speed in a predetermined area A2 of the polishing pad 2 by making the moving speed of the dresser 22 moving between a central portion and an outer peripheral portion of the polishing pad 2 to subject the polishing pad 2 to dressing higher than the moving speed in the predetermined area A2 in a standard moving recipe, thereby raising the speed of polishing the thin film on the substrate W polished by slidingly contacting with the predetermined area A2 of the polishing pad 2.
SHIMANO TAKAHIRO
| JP2000000761A | 2000-01-07 | |||
| JP2005125444A | 2005-05-19 | |||
| JP2010076049A | 2010-04-08 | |||
| JP2000000761A | 2000-01-07 |
| US20100227435A1 | 2010-09-09 |
Ryoji Kosugi
Tetsuya Hirosawa