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Patent Searching and Data


Title:
METHOD AND DEVICE FOR PRESS-FIXING SOLDER RIBBON
Document Type and Number:
Japanese Patent JPS6293070
Kind Code:
A
Abstract:

PURPOSE: To press-fix a solder ribbon in a short time and with a high productivity by bending the solder ribbon which has been supplied to the tip of a tool and bringing it to pressure welding to a substrate, and thereafter, cutting the solder ribbon from the joint of the bend part by an ascent of a clamper.

CONSTITUTION: As shown in a figure (a), a solder ribbon 16 which has been wound round a ribbon spool 17 is supplied vertically until it is projected a little by a prescribed quantity from the tip of a tool 16. Subsequently, as shown in figures (b), (c), the ribbon 16 which has been projected from the tip of a tool 18 is bent along the lower face of the tool 18 by a bender 40. Thereafter, as shown in figures (f)W(i), the tool 18 is made to descend and the bent ribbon 16 is brought to pressure welding to a substrate 86. Next, as shown in a figure K, the ribbon 16 is clamped by clampers 29, 30 which have been provided on the upper part of the tool 18, and thereafter, the clampers 29, 30 are made to ascend, the ribbon 16 is cut from the joint of the bend part of the ribbon 16, and the ribbon piece 16 is brought to pressure welding to the substrate 86. Thereafter, as shown in a figure l, the tool 18 and the clampers 29, 30 are made to ascend, and the solder ribbon 16 is projected from the tip of the tool 18.


Inventors:
SUZUKI YASUNOBU
USHIKI HIROSHI
Application Number:
JP23210885A
Publication Date:
April 28, 1987
Filing Date:
October 17, 1985
Export Citation:
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Assignee:
SHINKAWA KK
International Classes:
B23K3/06; H05K3/34; (IPC1-7): B23K3/06; H05K3/34
Domestic Patent References:
JPS595496U1984-01-13
JPS5629670U1981-03-20
JPS60166190A1985-08-29
Attorney, Agent or Firm:
Yoshinori Tanabe