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Patent Searching and Data


Title:
METHOD AND DEVICE OF PROCESSING GROOVE HOLE OF SQUARE CYLINDRICAL WORK
Document Type and Number:
Japanese Patent JP2004042162
Kind Code:
A
Abstract:

To provide a processing method and a device for improving productivity by reducing cutting time in processing a groove hole of a square cylindrical work.

This processing device 1 comprises a work support part 5 and a cutter support part 10 arranged on a machine table 3. The work support part 5 is movably constituted in the Y axis direction by positioning and fixing the work W. The cutter support part 10 is installed so that a circular saw blade 7 inclines to a rotary shaft of an installation attachment 40, and is movably constituted in the X axis direction and the Z axis direction. The groove hole is formed in the work W with a dimension between an upper end position and a lower end position of the circular saw blade 7 as a groove width dimension by slantingly installing the circular saw blade 7 to the axis.


Inventors:
NAGAO SHUNSUI
Application Number:
JP2002200402A
Publication Date:
February 12, 2004
Filing Date:
July 09, 2002
Export Citation:
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Assignee:
NAGAO MOKKO KK
International Classes:
B23C3/30; B23C5/08; B23D45/14; B23D61/02; (IPC1-7): B23C3/30; B23C5/08; B23D45/14; B23D61/02
Attorney, Agent or Firm:
Akio Iida
Kentaro Iida