PURPOSE: To improve the polishing accuracy of a sliding surface as well as the workability for processing of a magnetic head by holding a head chip to be processed so that it can be set close to or away from a lapping tape and at the same time securing deflection of the head chip in the width direction of the tape.
CONSTITUTION: A head chip 40 to be processed is hooked at chip hooking parts 62 and 63, and the position of the chip 40 is controlled by stoppers 64 and 65. Under such conditions, a positioning pin 70 is pressed toward the head by a rotary lever 72. Thus the lever 72 turns on a microswitch 74 and therefore a motor 52 is driven. Then an attachment unit 41 is totally moved up and down by a cam 50, and a gap part 40a of the head chip 40 contacts slidably for reciprocating in the width direction of a tape 20 under a high-speed run. At the same time, another motor is started to revolve a cam 55. Thus the chip 40 rubs the tape 20. The lapping process is through with one rotation of the cam 55. In such a way, the polishing accuracy and the workability are improved for processing of a magnetic head.
SATOU TAKAO
TAKAHASHI KENJI
Next Patent: JPS6040518