Title:
METHOD AND DEVICE FOR REALIZING UNIFORM PLATING THICKNESS BY CONTROLLING LOCAL CURRENT
Document Type and Number:
Japanese Patent JP3891980
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for improving the electroplating on a substrate to be plated having a feature different in density, and a device therefor.
SOLUTION: The method includes a step of preparing a plating bath having an anode and a step of immersing the substrate constituting a cathode in the plating bath separately from the anode. A second cathode including a screening part having an opening of different sizes coincident with a metal feature is arranged in such a state adjacent to the surface of the substrate and separated from the surface of the substrate between the substrate and the anode in the plating bath. The screening part has a larger size opening adjacent to a high density feature area to be plated and a smaller size opening adjacent to a low density feature area to be plated. The method includes a step of applying a voltage between the substrate and the anode and between the second cathode and the anode to allow an electric current to flow to the plating bath and a step of electroplating the metal feature different in density on the substrate.
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Inventors:
Thien Jen Chen
Todd Fowler
Ajay Gili
Anton Nenadik
Bressen Samuel
Keith Kwon Hong Wong
Todd Fowler
Ajay Gili
Anton Nenadik
Bressen Samuel
Keith Kwon Hong Wong
Application Number:
JP2003389992A
Publication Date:
March 14, 2007
Filing Date:
November 19, 2003
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
C25D7/12; C25D17/10; C25D5/00; C25D5/02; C25D17/12; C25D21/12; H01L21/288; H05K3/24; (IPC1-7): C25D17/10; C25D7/12; H01L21/288
Domestic Patent References:
| JP2222191A | ||||
| JP4246200A | ||||
| JP2001255405A | ||||
| JP8242061A | ||||
| JP2001332557A |
Attorney, Agent or Firm:
Hiroshi Sakaguchi
Yoshihiro City
Takeshi Ueno
Yoshihiro City
Takeshi Ueno