To provide a method and device for reforming surface by micro electric discharge that can perform surface reforming on a minimum necessary local area so that processing for improving hydrophilic property may be done only to a targeted desired position by controlling a micro discharge plasma generation area.
Linear high-voltage electrodes arranged at a predetermined interval on a two-dimensional(2D) surface and linear ground electrodes arranged at a predetermined interval on another 2D surface that is practically parallel to the 2D surface are arranged so as to intersect with each other on a 2D projected plan view; a substrate to be processed is arranged between the high-voltage electrodes and ground electrodes; the ground electrodes are brought into conductive contact with the processed substrate, the high-voltage electrodes and the processed substrate are arranged so as to face each other, high voltage is applied between the high-voltage electrodes and the ground electrodes; the high-voltage application area is supplied with a discharge gas to generate fine non-equilibrium discharge plasma; the electric supply operation to the high-voltage electrodes and ground electrodes is controlled; micro discharge plasma is generated at a region where the high-voltage electrodes and ground electrodes cross each other in the 2D projected plan view, thus reforming the desired positions on the surface of the processed substrate.
MAKISE RYUTARO
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Tetsuya Kazama
Katsumura Hiro
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen
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