Title:
METHOD AND DEVICE FOR REMOVING MOISTURE OF BOARD
Document Type and Number:
Japanese Patent JP3811689
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a moisture removing method and device improved in its liquid removing efficiency.
SOLUTION: In this method of removing the moisture of the board, the wave compressed air obtained by vibrating the compressed air with specific frequency is injected from a number of nozzles 18 of a rotary head 19 during its rotation, to be sprayed onto the board during its conveying by a conveyor at specific periods, whereby the moisture in a through hole or a blind through hole of the board is vibrated and removed. The moisture removing device comprises the conveyor for conveying the board 2, and a wave compressed air generating part for injecting the wave compressed air sprayed to the board during its conveying by the conveyor. The wave compressed air generating part comprises a compressed air generator, an oscillator for applying the wave of desired frequency to the compressed air generated from the compressed air generator to prepare the wave compressed air, and a rotation type rotary head comprising a nozzle for injecting the wave compressed air and spraying the same to the board conveyed by the conveyor. Whereby a problem that it is difficult to surely remove the moisture in a small part of the board of the complicated shape and that in the holes of the board, can be solved.
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Inventors:
Morishita Tadaho
Application Number:
JP2003273936A
Publication Date:
August 23, 2006
Filing Date:
July 14, 2003
Export Citation:
Assignee:
Miyako Roller Industry Co., Ltd.
International Classes:
F26B5/02; F26B3/30; F26B5/14; F26B5/16; F26B15/00; H01L23/12; H05K3/26; H05K3/42; (IPC1-7): F26B5/02; F26B3/30; F26B5/14; F26B5/16; F26B15/00; H01L23/12; H05K3/26; H05K3/42
Domestic Patent References:
JP7091827A | ||||
JP2001261U | ||||
JP47037642A | ||||
JP9113132A | ||||
JP6026249U | ||||
JP7225080A |
Attorney, Agent or Firm:
Masaharu Kobayashi
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