Title:
METHOD AND DEVICE FOR REMOVING RESIDUE
Document Type and Number:
Japanese Patent JP3462437
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a residue removing method and device capable of separating and removing the residue part from the product part effectively and accurately with less processes of operations without causing flaw to the product part.
SOLUTION: A pin 31 for the product part of a sheet 11 to be punched off is moved to an over retreat position 18 together with an interferntial pin 151 to interfere with the residue part of the sheet 11 by raising a template 7 for product part, while a pin 41 for the residue part 13 of the sheet 11 is moved to an under retreat position 19 together with an interferntial pin 152 to interfere with the product part of the sheet 11 by sinking a template 8 for residue part, and then the sheet 11 is placed on a pin 16 for products, and the residue parts of the sheet 11 are punched off separately by relative motions of an upper die 1 and lower die 2 approaching and separating to/from each other.
Inventors:
Chuji Yanagimoto
Application Number:
JP32458599A
Publication Date:
November 05, 2003
Filing Date:
November 15, 1999
Export Citation:
Assignee:
Resac Co., Ltd.
International Classes:
B26F1/44; B31B3/14; B31B50/20; (IPC1-7): B26F1/44; B31B1/20; B31B3/14
Domestic Patent References:
| JP487800A | ||||
| JP57160522A | ||||
| JP115262A |
Attorney, Agent or Firm:
Takeshi Nakatani
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