Title:
METHOD AND DEVICE FOR REMOVING RESIST
Document Type and Number:
Japanese Patent JP3202112
Kind Code:
B2
Abstract:
PURPOSE: To easily and excellently strip off and remove a resist film which becomes unnecessary on such an article as the semiconductor substrate, etc.
CONSTITUTION: The device is provided with a table 6 which attracts and holds a wafer in a prescribed attitude, adhesive tape sticking mechanism 8 which sticks an adhesive tape to the surface of the wafer held on the table 6, adhesive tape stripping off mechanism 9 which strips off the stuck adhesive tape from the surface of the wafer in a fixed direction, table rotating means which changes the rotation angle of the table 6, and wafer wetting mechanism which wets the surface of the wafer when required so that the device can perform adhesive tape stripping-off processes by a plurality of times in different directions.
Inventors:
Minoru Amaya
Masayuki Yamamoto
Matsuro Kanehara
Saburo Miyamoto
Masayuki Yamamoto
Matsuro Kanehara
Saburo Miyamoto
Application Number:
JP25769993A
Publication Date:
August 27, 2001
Filing Date:
September 20, 1993
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
G03F7/42; H01L21/027; H01L21/30; H01L21/304; (IPC1-7): H01L21/027; G03F7/42
Domestic Patent References:
| JP5275324A |
Attorney, Agent or Firm:
Tsutomu Sugitani