Title:
METHOD AND DEVICE FOR REPAIRING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2809207
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and device for repairing semiconductor device by which a semiconductor device can be replaced with another in a short time without giving any damage to adjacent or other components and causing any short circuit with the components.
SOLUTION: In order to melt solder, a bare chip 10 is heated by heating a substrate 11 mounted with the chip 10 while the substrate 11 is put on a heating table and a collet 5 is heated while the collet 5 is brought into contact with the chip 10. Then the chip 10 is sucked by vacuum with the collet 5 and removed from the substrate 11 by moving the chip 10 together with the collet 5. Therefore, highly reliable repairing can be performed on a semiconductor device, because the chip 10 can be heated efficiently with the heat of the collet 5 and no thermal damage is given to adjacent components.
Inventors:
NAKAJO TOSHIAKI
Application Number:
JP15207296A
Publication Date:
October 08, 1998
Filing Date:
June 13, 1996
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L21/60; H05K3/34; H05K3/22; (IPC1-7): H01L21/60; H01L21/60
Domestic Patent References:
| JP637145A | ||||
| JP817973A | ||||
| JP8250544A | ||||
| JP9129648A | ||||
| JP8148522A | ||||
| JP7176567A | ||||
| JP837206A |
Attorney, Agent or Firm:
Suzuki Akio