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Title:
METHOD AND DEVICE FOR SHAPING SOLDERING FORM OF CREAM SOLDER PRINTED ON PRINTED BOARD AND METHOD AND DEVICE FOR STORING PRINTED BOARD PRINTED WITH CREAM SOLDER
Document Type and Number:
Japanese Patent JP2000196233
Kind Code:
A
Abstract:

To provide means and device for shaping soldering form capable of improving forms of cream solder, by shaping soldering shape of cream solder printed on a printed board to prevent solder leakage in the lateral direction, keeping a good quality even after a long period of standby for mounting, and, moreover, positively putting the solder under vibration; and also to provide method and device for storing printed board.

A printed board printed with cream solder is turned over so that the printed surface of the cream solder is downward by a turning-over machine 12. Then, the board is vibrated by a vibrator 13 to shape the cream solder. Moreover, when it takes long time from printing till mounting due to a trouble or the like in a proceeding processes, the board is kept in a sealed container sealed in a saturated atmosphere of nitrogen gas.


Inventors:
KINOSHITA SHINGEN
Application Number:
JP36976198A
Publication Date:
July 14, 2000
Filing Date:
December 25, 1998
Export Citation:
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Assignee:
RICOH MICROELECTRONICS CO LTD
International Classes:
H05K3/34; B41M7/00; (IPC1-7): H05K3/34; H05K3/34
Attorney, Agent or Firm:
Kuroda Toshi