Title:
METHOD AND DEVICE OF TRANSFER OF DISC-LIKE MATERIAL TO BE TREATED
Document Type and Number:
Japanese Patent JP3200326
Kind Code:
B2
Abstract:
PURPOSE: To transfer the disc-like material to be treated such as a semiconductor wafer etc., without coming into contact with the outer circumference of the material to be treated.
CONSTITUTION: A water W passes between light-emitting elements 6a to 8a and light-receiving elements 6b to 8b by pulling in an arm 3. By this passage, the six points of intersection of the line which links each light-emitting element and each light receiving element and the outer circumference of the water W are found, three points are selected from the six points, and the circumscribed circle, passing the above-mentioned three points, and the center of the wafer W are found.
Inventors:
Tsutomu Sabota
Koji Ueda
Hidenori Miyamoto
Toru Arikawa
Koji Ueda
Hidenori Miyamoto
Toru Arikawa
Application Number:
JP9817695A
Publication Date:
August 20, 2001
Filing Date:
April 24, 1995
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
B65G49/07; H01L21/027; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B65G49/07; H01L21/027
Domestic Patent References:
| JP6448443A | ||||
| JP5226437A | ||||
| JP574699A |
Attorney, Agent or Firm:
Yu Koyama