To shorten work time by selecting an optimum working system.
When working a workpiece at a plurality of working positions scattered on the workpiece while cooperatively operating a low-speed positioning means which extensively moves a working position on the work and a high-speed positioning means which moves the working position on the work in a narrow range in a predetermined rectangle in parallel, a low-speed positioning means stop working 140 to stop the low-speed positioning means and to operate the high-speed positioning means, a low-speed positioning means non-stop working 160 to operate the high-speed positioning means while moving the low-speed positioning means, and a hybrid working 150 to jointly use the low-speed positioning means stop working and the low-speed positioning means non-stop working, are properly used.
OKUDAIRA YASUYUKI
TANEDA AKIHIKO
JP2001195112A | 2001-07-19 | |||
JPH10284362A | 1998-10-23 | |||
JPH11317367A | 1999-11-16 | |||
JPH1154416A | 1999-02-26 | |||
JP2001080135A | 2001-03-27 | |||
JPH02103156A | 1990-04-16 |
Tsuyoshi Makino
Keisuke Matsuyama
Next Patent: WAFER POLISHING DEVICE AND WAFER POLISHING METHOD