To provide a dicing method of a semiconductor member that has a small amount of clogging in a rotary blade for dicing and high chipping resistance, and suppresses a chip jump.
The method of dicing the semiconductor member uses an adhesive sheet 101 having a base material sheet 102 and a pressure-sensitive type adhesive layer 103 laminated on the base material sheet 102. The method includes: a step of sticking the semiconductor member 104 to the pressure-sensitive type adhesive layer 103 of the adhesive sheet 101; a step of irradiating the pressure-sensitive type adhesive layer 103 with ultraviolet rays to increase the adhesiveness between the pressure-sensitive type adhesive layer 103 and the semiconductor member 104 after the sticking process; and a step of dicing the semiconductor member 104 after the step of applying ultraviolet rays. In the dicing method of a semiconductor member, the pressure-sensitive type adhesive layer 103 contains a (meth) acrylic acid ester copolymer and a curing agent.
TAKESUE HIRONORI
| JP2004119780A | 2004-04-15 |
Akihiko Okuno
Sonoda Yoshitaka