Title:
METHOD FOR DIRECTLY FORMING ELECTROPLATING LAYER ON NON-CONDUCTIVE MATERIAL SURFACE
Document Type and Number:
Japanese Patent JPH05287582
Kind Code:
A
Abstract:
PURPOSE:To easily electroplate a non-conductive material with Cu by forming an Mn oxide layer on the material surface and dipping the material in a specified org. monomer soln. to form a conductive polymer coating film. CONSTITUTION:The surface of a non-conductive material is dipped in a soln. of an alkaline permanganate and cleaned, and an Mn oxide layer is formed on the surface. The material is then dipped in an org. monomer soln. kept at pH <4 and contg. 1-9g/l of aniline or its derivative, at least one kind among borofluoric acid, perchloric acid, sulfuric acid, aromatic sulfonic acid or further at least one kind of the fine powder of the conductive material such as C, Pd-Sn colloid, copper sulfide, nickel sulfide and ITO. An org. monomer is converted into a polymer film by the oxidation reaction of the org. monomer with manganese oxide to make the non-conductive material conductive. Consequently, the non-conductive material surface is easily electroplated with Cu without using troublesome chemical plating.
Inventors:
YAMATO SHIGERU
OOHARADA AKIYOSHI
TADAKOSHI MITSUAKI
OOHARADA AKIYOSHI
TADAKOSHI MITSUAKI
Application Number:
JP9263792A
Publication Date:
November 02, 1993
Filing Date:
April 13, 1992
Export Citation:
Assignee:
OKUNO CHEM IND CO
International Classes:
C25D5/34; H05K3/10; H05K3/24; H05K3/42; H05K3/46; (IPC1-7): C25D5/34; H05K3/10; H05K3/24; H05K3/42; H05K3/46
Attorney, Agent or Firm:
Eiji Saegusa (4 others)