To surely discriminate a failure semiconductor device or a conforming semiconductor device, by performing semiconductor device electrical test, marking a semiconductor device discriminated as a failure product with an ink containing a discriminating material, and discriminating the marked semiconductor device based on the characteristic of the discriminating material.

The probe of a prober is automatically placed on the bonding pad of each chip formed on a wafer for electrical connection with an external tester and electrical test is performed on each chip. Then, an ink is applied on a chip which has been judged as failure by the tester in the test process. In such marking process, an ink INK containing a discriminating material is used. For example, the ink INK is applied on a failure chip CN. When the discriminating material is composed of a magnetic material, even an extremely small quantity of the ink INK can be detected, and when the discriminating material is composed of a fluorescent material, an image information can be easily discriminated even when the marking diameter is small.