Title:
METHOD FOR DISTRIBUTING CHIP WITH SOLDER BUMP ON FRONT SURFACE USING TAPE FOR CARRYING CHIP
Document Type and Number:
Japanese Patent JP3486371
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for mounting a flip chip speedily suited for a flip flop bonding by taking out an IC chip.
SOLUTION: A tape system for transportation for a flip-chip assembly device is configured so that a chip 14 is taken out of the reverse side of a tape 13 for transportation. In this case an evacuation head 21 of a take-out device 16 touches the reverse side of the IC chip 14, a die take-out pin 17 pushes up the IC chip 14 and takes it out with the circuit side (where a solder bump is located) of the chip 14 facing downward.
Inventors:
Thomas Dixon Dadderer
Charles Gatentag
Charles Gatentag
Application Number:
JP14717699A
Publication Date:
January 13, 2004
Filing Date:
May 26, 1999
Export Citation:
Assignee:
Lucent Technologies, Inc.
International Classes:
H05K13/02; H01L21/00; H01L21/50; H01L21/60; H01L21/683; (IPC1-7): H05K13/02
Domestic Patent References:
| JP8316690A | ||||
| JP4199796A | ||||
| JP715175A |
Attorney, Agent or Firm:
Masao Okabe (11 others)
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