Title:
METHOD FOR DIVIDING SEMICONDUCTOR CHIP ENCAPSULATED WITH RESIN
Document Type and Number:
Japanese Patent JPH11317383
Kind Code:
A
Abstract:
To mount plural semiconductor chips on a ceramic substrate and to divide the chips after encapsulating them with resin.
Plural semiconductor chips are mounted on a ceramic substrate 1. After encapsulating with resin, a ceramic filler is mixed with the encapsulating resin. Notches 2 are formed on the side other than the chip mounted side of the ceramic substrate 1 along the cutting lines. The ceramic and the encapsulating resin are divided along the lines of notches 2, by pressing from the encapsulating resin side of the reverse side to separate the chip pieces.
Inventors:
SAGAMI YOSUKE
Application Number:
JP16129398A
Publication Date:
November 16, 1999
Filing Date:
May 06, 1998
Export Citation:
Assignee:
DEXTER KK
International Classes:
H01L23/29; H01L21/301; H01L21/56; H01L23/13; H01L23/31; (IPC1-7): H01L21/301; H01L21/56; H01L23/13; H01L23/29; H01L23/31
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