To provide a method of dividing a substrate by which the damage to the function part of the end face of the substrate is avoided and also two substrates arranged opposingly are simultaneously divided by the external force of one time.
Reforming regions 5 are formed by emitting the laser beam individually to the respective two substrates 1, 2 from the opposing and the opposite side and also the reforming regions 5 are formed by condensing the laser beams by aberration compensation in the vicinity of the end face of the opposing side of an TFT substrate 1 on which the function part 6 consisting of a polyimide film is formed and a crack having high rectilinear propagation property is generated on the end face of the opposing side of the TFT substrate 1 on which the function part 6 is formed by internal stress caused by the swelling of the reforming region. The reforming regions 5 are formed by condensing the laser beams by aberration compensation in the vicinity of the opposing side and the end face on the opposite side of an opposing substrate 2 which is opposed to the TFT substrate 1 on which the functional part 6 is formed and a crack having high rectilinear propagation property is also generated on the end face of the opposite side by the internal stress caused by the swelling of the reforming region.
| WO/2019/061963 | CUTTING METHOD EMPLOYING LASER |
| WO/2003/018248 | METHOD AND DEVICE FOR MICROMACHINING A WORKPIECE BY MEANS OF LASER RADIATION |
| JPH03155488 | LASER BEAM CUTTING METHOD |
Osamu Suzawa
Kazuhiko Miyasaka
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