Title:
METHOD FOR DIVIDING SUBSTRATE WAFER INTO A PLURALITY OF SUBSTRATE CHIPS
Document Type and Number:
Japanese Patent JP2002093749
Kind Code:
A
Abstract:
To provide a method for dividing a substrate wafer into a plurality of substrate chips, capable of obtaining a substrate chip having its basal surface particularly flexible and realizing time-saving dividing.
The substrate chip (20) is divided each other by a selective deep structure method capable of controlling material exfoliation deliberately limited in the lateral direction and preferential spatial in-depth of material to be worked.
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Inventors:
FISCHER FRANK
GRAF ECKHARD
GRAF ECKHARD
Application Number:
JP2001195317A
Publication Date:
March 29, 2002
Filing Date:
June 27, 2001
Export Citation:
Assignee:
BOSCH GMBH ROBERT
International Classes:
H01L21/301; H01L21/304; H01L21/78; (IPC1-7): H01L21/301
Attorney, Agent or Firm:
Toshio Yano (4 outside)
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