Title:
METHOD FOR DRY-ETCHING SUBSTRATE
Document Type and Number:
Japanese Patent JP2007016261
Kind Code:
A
Abstract:
To provide a method for dry-etching a substrate, which can easily control a temperature of the substrate by cooling and heating the substrate, prevents an etching apparatus from being etched, and besides, facilitates the handling of the substrate.
This dry etching method comprises the steps of: fixing the substrate 1 to a support 2 by making a grease 3 containing a thermoconductive filler exist between them; dry-etching the substrate 1 into a predetermined shape; and separating the substrate 1 from the support 2.
Inventors:
IKEDA TAKASHI
MAEDA TOMOYA
MAEDA TOMOYA
Application Number:
JP2005197147A
Publication Date:
January 25, 2007
Filing Date:
July 06, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C23F4/00; H01L21/3065
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano
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