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Title:
METHOD FOR ELECTROSTATICALLY COATING INSULATION SUBSTRATE
Document Type and Number:
Japanese Patent JP2003039010
Kind Code:
A
Abstract:

To provide a method for electrostatically coating an insulation substrate using a conductive primer composition soluble in water and a water- containing organic solvent, having high conductivity and excellent film forming properties, having excellent capacity not generating separation and flocculation even during long-term preservation, capable of being simply applied to the surface of insulation matter such as plastic or the like because soluble in a solvent, especially water and the water-containing organic solvent, forming a conductive primer layer showing excellent water resistance by crosslinking and enhanced in the compatibility with a topcoat coating, electrostatic coating efficiency and adhesiveness.

The crosslinkable conductive primer composition contains a water soluble conductive polymer having a sulfonic acid group and/or a carboxy group, a solvent and a silane coupling agent as essential components and, if desired, contains colloidal silica, a polymeric compound and/or a colorant.


Inventors:
SAITO TAKASHI
UZAWA MASASHI
Application Number:
JP2002140674A
Publication Date:
February 12, 2003
Filing Date:
May 15, 2002
Export Citation:
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Assignee:
MITSUBISHI RAYON CO
International Classes:
B05D1/04; B05D5/12; C08G61/02; C08G61/12; C08G73/02; (IPC1-7): B05D1/04; B05D5/12; C08G61/02; C08G61/12; C08G73/02