To provide a method for embedding a commercial integrated circuit (IC) chip or a micro-system (hereafter abbreviated as ISM) including a sensor, an IC chip and related circuits in a rubber elastic body, and a method for strengthening sensing functionality of the rubber elastic body.

The method for embedding an ISM in rubber comprises first engraving an engraved space 9 enough to house a specified ISM on the surface of the first layer unvulcanized rubber 8 to embed the ISM in the rubber, and housing a vulcanized rubber chip 11 and the ISM 10 into the space. In this case, the vulcanized rubber is preferably arranged around the ISM so that the ISM is positioned in the center of the engraved space. The vulcanized rubber preferably has JIS hardness of ≤50 because damage to the ISM part is feared with ≥70 hardness rubber. After filling the ISM and the vulcanized rubber chip fully in the engraved space, the second layer unvulcanized rubber 12 is placed thereon and forming under heat and pressure is performed with a mold prepared in advance. In this case, vulcanizing temperature and vulcanizing time are controlled so that the ISM in the engraved space is not heated to 70°C or higher, and ≥50 kg/cm2 pressure is not applied on each part of the ISM.