METHOD FOR ENCAPSULATING ELECTRONIC COMPONENT AND ENCAPSULATED ELECTRONIC COMPONENT

Title:

METHOD FOR ENCAPSULATING ELECTRONIC COMPONENT AND ENCAPSULATED ELECTRONIC COMPONENT

Document Type and Number:

Japanese Patent JP2004235640

Kind Code:

A

Abstract:

To provide a method for encapsulating an electronic component and an electronic component manufactured by the method; to compensate difference of thermal expansion between the component and a plastic capsule in spite of a perfect encapsulation of the component by plastic in the method and the electronic component.

In the method, a coating layer made up of a flowable coating material is provided for the component, the coating material of the coating layer is hardened, and the product, which is composed of the component and the coating layer, is perfectly encapsulated in plastic. The electronic component is encapsulated by the coating layer, which is made up of the coating material applied fluidly and hardened, and the plastic capsule to envelop the coating layer.

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Inventors:

AUBURGER BERNHARD
BAUER KLAUS
HENZINGER RONALD
JAEGER WIGHARD
LEIDERER HERMANN
RUBEY ARMIN

Application Number:

JP2004018778A

Publication Date:

August 19, 2004

Filing Date:

January 27, 2004

Export Citation:

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Assignee:

SIEMENS AG

International Classes:

H01L23/29; H01C1/02; H01C1/032; H01G4/224; H01L23/31; H05K5/06; (IPC1-7): H01L23/29; H01C1/02; H01C1/032; H01G4/224; H01L23/31

Attorney, Agent or Firm:

Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel

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