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Title:
METHOD AND EQUIPMENT FOR CONTROL IN HEAT TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP2627390
Kind Code:
B2
Abstract:

PURPOSE: To control a heat treatment temperature for a product of each sort or the like to be a heating condition temperature of a target value, properly and correctly at all times.
CONSTITUTION: While a heating temperature of a current value of an article M and the position thereof are measured, a deviation of the heating temperature of the current value from a heating condition temperature of a target value is determined and subjected to a PID operation, and the position of the article M is shifted so that heat treatment of the article M be executed at the heating condition temperature of the target value. With the article M moved between a high temperature area and a low temperature area, according to this constitution, the heat treatment thereof is executed at a set temperature and the heating condition temperature and under an optimum heating condition which are target values.


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Inventors:
Tsubokura Tsugio
Toru Takahashi
Ito Tadashi
Application Number:
JP31567892A
Publication Date:
July 02, 1997
Filing Date:
October 30, 1992
Export Citation:
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Assignee:
Kyowa High Heat Industry Co., Ltd.
Nippon Insulator Co., Ltd.
International Classes:
F27B17/00; F27D19/00; (IPC1-7): F27B17/00; F27D19/00
Domestic Patent References:
JP214514A
Attorney, Agent or Firm:
Nishiichi